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Multi channel chillers

Dual channel chiller or Three channel chiller for semiconductor industry

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  • There are two or more channels with the same/different specifications in one housing;
  • The temperature of two fluid channel systems can be controlled separately by one host;
  • One power supply system realizes the temperature control of 2 channels, reducing the wiring work time;
  • By controlling the variable frequency compressor, variable frequency fan, and electronic expansion valve at the same time, it can still maintain good temperature stability when the heat load fluctuates;
  • Use a pump without mechanical seal. There is no need to regularly check the pump for leakage and replace the mechanical seal.

Dual channel chillers
Three channel chillers
ETCU Heat exchange chillers
ModellFLTZ-203W-2T
Pipelinechannel 1channel 2
Temperaturbereich -20℃~+90℃ -20℃~+90℃
Kühlleistung4kW@-10℃4kW@-10℃
Heizleistung2kW2kW
Durchflussmenge des wärmeleitenden Mediums20L/min@0.5MPa20L/min@0.5MPa
Heat conducting medium connection sizeZG3/4ZG3/4
Temperatur in der Umgebung10~35℃10~35℃
Luftfeuchtigkeit der Umgebung30~70%30~70%
Temperatur des Kühlwassers15~20℃15~20℃
Cooling water flow rate20L/min20L/min
Stromkreisunterbrecher30A
Gewicht400kg
Abmessung cm500*900*1600
Kontrolle der ProzesstemperaturThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModellFLTZ-406W/ETCU-015W
Pipelinechannel 1channel 2
Temperaturbereich -45℃~+40℃+10℃~+80℃
Kühlleistung11kW@-20℃
5kW@-40℃
13kW@+10℃
Heizleistung2kW6kW
Durchflussmenge des wärmeleitenden Mediums17L/min@0.7MPa17L/min@0.7MPa
Heat conducting medium connection sizeZG3/4ZG3/4
Temperatur in der Umgebung10~35℃10~35℃
Luftfeuchtigkeit der Umgebung30~70%30~70%
Temperatur des Kühlwassers15~20℃15~20℃
Cooling water flow rate40L/min20L/min
Stromkreisunterbrecher80A
Gewicht550kg
Abmessung cm600*1000*1850
Kontrolle der ProzesstemperaturThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModellFLTZ-203W/ETCU-008W
Pipelinechannel 1channel 2channel 3
Temperaturbereich -10℃~+60℃+30℃~+80℃-10℃~+80℃
Kühlleistung4kW@-10℃/21kW@+20℃6 kW@+30℃3kW@-10℃
Heizleistung4kW4.5+6kW3kW
Durchflussmenge des wärmeleitenden Mediums17L/min@0.7MPa17L/min@0.7MPa17L/min@0.7MPa
Heat conducting medium connection sizeZG3/4ZG3/4ZG3/4
Temperatur in der Umgebung10~35 ℃10~35 ℃10~35 ℃
Luftfeuchtigkeit der Umgebung30~70%30~70%30~70%
Cooling water flow rate15~20℃15~20℃15~20℃
Temperatur des Kühlwassers30L/min@15~20℃15L/min@15~20℃15L/min@15~20℃
Stromkreisunterbrecher100A
Gewicht600kg
Abmessung cm600*1000*1700
Kontrolle der ProzesstemperaturThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModellFLTZ-203W/2T DoppelsystemFLTZ-305W/2T  dual systemFLTZ-406W/2T Doppelsystem
Temperaturbereich-20℃~90℃ -30℃~90℃-45℃~90℃
Durchflussmenge des wärmeleitenden Mediums15~45l/min 6bar max
Heizleistung2,5 kW2,5 kW2,5 kW2,5 kW3,5 kW3,5 kW
Kühlleistung3kW bei-15℃3kW bei-15℃5kW bei-15℃5kW bei-15℃2,5 kW bei -35℃2,5 kW bei -35℃
Volumen der internen Zirkulationsflüssigkeit5L5L8L8L8L8L
Volumen des Ausdehnungsgefäßes15L25L25L
Wärmeleitendes MediumFluorierte Flüssigkeit, Frostschutzmittel, wärmeleitendes Silikonöl, usw.
KältemittelR404A/ R448
Schnittstelle zum wärmeleitenden MediumZG3/4
Schnittstelle zum KühlwasserZG3/4
Schnittstelle zum Kühlwasser50L/min bei20℃600L/min bei20℃50L/min bei20℃
StromDreiphasig 220V/Dreiphasig 400V/Dreiphasig 460V
Kontrolle der ProzesstemperaturDie Fernzieltemperatur kann durch die Kombination des selbst erstellten Modells frei selbst gebaut
Algorithmus und Kaskadenalgorithmus

ModellFLT-215W/ETCU-015W/ETCU-008W
Pipelinechannel 1channel 2channel 3
Temperaturbereich-20℃~+50℃+30℃~+100℃+30℃~+40℃
Kühlleistung15kW@-10℃13kW@PCW+15℃8kW@PCW+10℃
Heizleistung2kW6kWWärmeverlust der Pumpe
Durchflussmenge des wärmeleitenden Mediums30L/min@0.85MPa30L/min@0.85MPa20L/min@0.8MPa
Heat conducting medium connection sizeZG3/4ZG3/4ZG3/4
Temperatur in der Umgebung10~35 ℃10~35 ℃10~35 ℃
Luftfeuchtigkeit der Umgebung30~70%30~70%30~70%
Cooling water flow rate15~20℃15~20℃15~20℃
Temperatur des Kühlwassers30L/min@15~20℃15L/min@15~20℃15L/min@15~20℃
Stromkreisunterbrecher75A
Gewicht600kg
Abmessung cm600*1000*1700
Kontrolle der ProzesstemperaturThe remote target temperature can be controlled by combining the self created model free self built tree algorithm and cascade algorithm

ModellETCU-005WETCU-015WETCU-030WETCU-050WETCU-100WETCU-200WETCU-300W
TemperaturbereichCooling water temperature +5℃~90℃
Genauigkeit der Temperaturregelung±0.05℃(Steady state outlet temperature)
Temperatur des Kühlwassers7℃~30℃ Cooling water flow is controlled by Siemens/Honeywell regulating valves
Kühlleistung5kW15kW30kW50kW100kW200kW300kW
Test conditions: When the maximum circulation amount, the temperature difference between
the temperature control temperature and the cooling water temperature is 15℃
Umwälzpumpe7~20L/min 5bar15~40L/min 5bar20~60L/min 5bar40~110L/min 5bar150~250L/min 5bar250~500L/min 5bar400~650L/min 5bar
Tankvolumen5L10L20L30L60L120L240L
Abmessung cm480*750*390480*750*390480*750*500CustomizationCustomizationCustomizationCustomization
Kontrolle der ProzesstemperaturThe remote target temperature can be controlled by combining the self created model free self
 built tree algorithm and cascade algorithm

FLTZ multi-channel chillers are widely used in the semiconductor industry due to their advantages such as precise temperature control, independent circuit management, and rapid cooling. The application scenarios of semiconductor chillers include wafer manufacturing, packaging testing, photolithography, etching, CVD/PVD deposition, cleaning processes, etc.

Ion implantation

The high-energy particle beam generated during ion implantation can cause local high temperatures. The process chiller can quickly remove heat to prevent thermal damage to the wafer.

Etching

During plasma etching (RIE, ICP, etc.), the chamber and electrodes need to be strictly temperature controlled to ensure etching uniformity. The chiller can provide a stable temperature environment for etching equipment and reduce process deviations

Chip packaging

In the packaging process of BGA, CSP, FCBGA, etc., the temperature control of welding and packaging materials affects reliability

PVD/CVD

CVD (such as LPCVD, PECVD) and PVD (such as sputtering coating) are used for thin film deposition, and the temperature control of the chamber and substrate affects the quality of the film.

Photolithography

The exposure system, optical lenses, laser light sources, and mask plates of the photolithography machine require precise temperature control to ensure pattern accuracy.

Wet cleaning

Used to help maintain deionized water within a specific temperature range to remove photoresist residues, metal contamination and particulate matter.

If you need independent temperature control for multiple different equipment or processes, and don’t want to buy multiple independent chillers, then FLTZ multi-channel chillers are a very ideal choice.

With the help of the Internet, we have built a global consulting, sales and service network. We have served more than 30,000 customers worldwide and have more than 90 patents.

Our chillers have been selected by more than 100 university laboratory projects around the world and exported to more than 20 countries. We have agents in various European countries and regions such as Singapore, Malaysia, Japan, South Korea, Qatar, Middle Eastern countries, Australia, the Netherlands, Spain and the United States.

We can customize it for you. For example, cooling capacity, power supply, size
We can customize the voltage and phase of the chiller according to your needs.

Generally, our multi-channel water dispenser for you includes two types: dual channel and triple channel,
If you have other channel requirements, you can contact us for customization.

LNEYA not only provides temperature control systems for semiconductor chillers, but also offers gas coolers for testing in downstream processes, and even provides temperature chambers.

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