LNEYA Industriekühler Hersteller Lieferant
Halbleiter-Packaging und Prüfverfahren
LNEYA has rich experience in product research and development in the semiconductor packaging and testing industry, and its rich product line meets various temperature control needs in the industry.
Die Produkte umfassen: FLTZ-Serie Hochpräzisions-Kühlerheizungen, LT-Serie Kühlgeräte, Wärmeübertragungs- und Temperaturregelgeräte ETCU, Direktkühlmaschinen ZLJ/ZLTZ, Gas-Kühler AES/LQ/AI/AET/Gas-Trockner, Kammerprüfkästen und andere Produkte.
LÖSUNG
Der Prozess der Halbleiterverpackung und -prüfung ist ein wichtiges Glied im Halbleiterproduktionsprozess, einschließlich der Waferprüfung, der Chipverpackung und der Prüfung nach der Verpackung. Dieser Prozess erfordert nicht nur hohe Präzision und Zuverlässigkeit, sondern auch eine strenge Temperaturkontrolle, um Produktqualität und Leistung zu gewährleisten.
The typical packaging process is: dicing, mounting, bonding, plastic sealing, deburring, electroplating, printing, cutting and molding, appearance inspection, finished product testing, packaging and shipment.
FLTZ Frequenzumwandlungsserie
—Temperature control accuracy ±0.05℃ (Outlet temperature steady state)
-90~+100℃, mainly used for precise temperature control in semiconductor production and testing processes. The company applies a variety of algorithms in the system to achieve fast system response and high control accuracy.
LTZ Variabel Frequenz Serie
—Adopt frequency conversion technology, high efficiency and energy saving
Die Frequenzumwandlungstechnologie sorgt für hohe Effizienz und Energieeinsparung. Die frequenzvariable Kompressoreinheit ändert die Betriebsgeschwindigkeit des Gleichstromkompressors jederzeit entsprechend den Kühl- und Heizlastanforderungen des Benutzers durch das eingebaute Frequenzumwandlungsgerät, wodurch die Konfrontation von Kompressor und elektrischer Heizung unter Volllast vermieden wird, ein stabiler Arbeitszustand der Einheit aufrechterhalten und Energiespareffekte erzielt werden.
Thermal / Vacuum chuck
— 8-inch and 12-inch vacuum chucks and non-standard customized square cold plates
LNEYA supporting a temperature range of -70℃~+200℃, and can also customize various other temperature ranges, built-in multiple temperature sensors, multi-zone temperature control, precise FID adjustment and temperature control; supports direct cooling, liquid cooling, and air cooling.
Wärmeaustauschkühler ETCU
—No compressor
ETCU compressor-free heat exchange system, the system can be universal expansion tank, condenser, cooling water system, etc., which can effectively reduce the size of equipment and reduce the number of operating steps.
Temperaturfühler
—Chip design, chip production process testing
Unterstützt schnelles Heizen und Kühlen von extrem niedrigen bis hohen Temperaturen. Die schnellste Rate kann 50°C/min erreichen. Es kann die Temperatur genau steuern, und der Fehler liegt normalerweise innerhalb von +0,2°C.
ZLTZ Heat Exchange Chillers
—Highly efficient heat exchange, automatic recovery of heat transfer medium
ZLTZ temperature control unit is combined with a microchannel reactor to achieve high exothermic temperature control. Under the same flow rate conditions, the heat transfer efficiency is more than five times that of thermal oil heat exchange and temperature control. At the same time, the inlet and outlet temperature difference is small, and the temperature field is highly uniform, making it particularly suitable for applications with violent exothermic reactions.
ZLJ Direct low temp chillers
—Can be used for gas capture
The refrigerant in the refrigeration system is directly transferred to the target control element (heat exchanger) for heat exchange, thereby cooling the target control object. This system has a heat exchange capacity that is typically more than five times greater than that of a fluid (gas) being transferred to a heat exchanger. This makes it particularly suitable for applications where the heat exchanger has a small heat exchange surface but a high heat transfer capacity.
Testkammer für schnelle Temperaturänderung
—Fast temperature change, fast heating and cooling rate
Anwendbar auf Umweltstress-Screening-Test, durch Umweltstress-Screening von Produkten, beschleunigen die Entdeckung von Produkt-Design-Fehler und zur Verbesserung der Produktzuverlässigkeit. Viele Branchen haben erkannt, dass Hochgeschwindigkeits-Temperaturwechsel-Zyklustests unzuverlässige Systeme identifizieren können, die bereits in die Produktionstestphase eingetreten sind. Sie hat sich zu einer Standardmethode zur Verbesserung der Qualität und zur effektiven Verlängerung der normalen Lebensdauer von Produkten entwickelt.
Chip Aging Test Chamber
—Applicable for semiconductor PCB aging testing
By precisely controlling environmental parameters such as temperature and humidity, we simulate extreme conditions such as high temperature, high humidity, and high stress that chips may encounter in actual use, accelerating the chip aging process. In this way, we can screen out early-failed chips in a short period of time, optimize design solutions, and improve product yields.
LQ-Reihe
—Low temperature can reach -110℃
Angewandt zur Abkühlung des Gases (nicht korrosiv): Wenn trockene Druckluft, Stickstoff, Argon und andere Gase mit normaler Temperatur in die Geräte der Serie LQ eingeleitet werden, kann das austretende Gas die angestrebte niedrige Temperatur erreichen und den zu prüfenden Komponenten oder Wärmetauschern zugeführt werden.
AES Wärmestrom
—Fast heating and cooling rate, +150℃～-55℃ in less than 10S
Bietet genaue und schnelle Umgebungstemperaturmessungen für Chips, Module, integrierte Schaltkreise, elektronische Bauteile usw. Es ist ein Instrument für elektrische Leistungstests von Produkten, Fehleranalyse und Zuverlässigkeitsbewertung.
AET Themal Test System
—Optional control of outlet gas temperature and process target temperature
Compressed air enters the gas rapid temperature change tester, which has a built-in desiccant to pre-dry the gas to a dew point below -70 degrees Celsius. Cooling and heating temperature control are then applied to output gas at a stable flow rate, pressure, and constant temperature. This temperature control is performed on target objects (such as various temperature-controlled chucks, cavity environments, heat plates, material shuttles, cavities, electronic components, etc.). The process temperature is controlled using a temperature sensor on the remote chuck, automatically adjusting the output gas temperature.
AI Kühlzirkulationseinheit
—Circulating air high and low temperature constant temperature test
Used in high and low temperature testing of semiconductor equipment. It provides a heat source for high and low temperature constant temperature testing of electronic equipment. It has an independent refrigeration cycle fan unit and can operate continuously for long periods of time, with automatic defrosting, and the defrosting process does not affect the storage temperature.
Industrieller Gastrockner
—Low dew point drying and cleaning
It is used in sensors, semiconductor manufacturing, film and packaging material licensing, powder material transportation, spraying systems, food industry, pharmaceutical industry, etc., which require a distributed air source with a low dew point of -80℃ and cleanliness.
Negative pressure type Kühler
—Achieve temperature fluctuation ≤±0.3℃
Precise temperature control is achieved through fluid circulation in a negative pressure environment. Working principle: A negative pressure generator drives the heat transfer medium (water/oil) to circulate, eliminating the risk of leakage. Suitable for cooling various types of boards.
