LNEYA jet cooling heating temperature control device application note
The jet cooling heating temperature control device is applied to components to provide accurate and rapid ambient temperature for chips, modules, integrated circuit boards, electronic components, etc., and is indispensable for product electrical performance testing, failure analysis, and reliability evaluation. Instrumentation.
LNEYA jet refrigeration heating temperature control devices are widely used in semiconductor companies, aerospace, optical communications, universities, research institutes and other fields. Compared with the traditional thermostat, the jet cooling heating temperature control device has the following characteristics: temperature range: -120 ° C ~ +300 ° C; the temperature rise and fall rate is very fast, -55 ° C ~ 150 ° C < 10 seconds; temperature control accuracy :±1°C; Temperature setting capability: ±0.1°C; Temperature display capability: ±0.1°C; Large air flow: 25m3/h; Real-time monitoring of the actual temperature of the IC under test, real-time closed-loop feedback, real-time adjustment of gas temperature; Control, programmable operation, manual operation, remote control.
The jet-type cooling and heating temperature control device is applied to applications requiring rapid rise/down of temperature. For a single IC (module) of many components on the PCB, it is isolated and separately subjected to high and low temperature impact without affecting other peripherals. The device performs temperature cycling/shock on the IC on the load board of the tester platform; conventional thermostats cannot provide accurate and fast ambient temperature for the entire integrated circuit board for such testing.
The integrated circuit for the application of the jet-type cooling and heating temperature control device has various packages, but the metal casing, the ceramic casing, the plastic casing, etc. are common, and have a round flat shape. The order of the pins is generally viewed from the top of the casing. Read counterclockwise, one of which is the foot near the mark.
The actual application of the jet refrigeration heating temperature control device is relatively wide. Users are welcome to contact if they need test equipment in the component industry. (This article is from the source network, if there is any infringement, please contact Lneya to delete, thank you.)

Verwandte Empfehlungen
-
Der Unterschied zwischen der Direktkontakt-Flüssigkeitskühlung und der Technologie der Kühlplatten-Flüssigkeitskühlung
1199Die Kühlplatten-Flüssigkeitskühlung ist ein Implementierungsverfahren, bei dem die Wärme der Heizkomponenten indirekt auf die Kühlflüssigkeit übertragen wird, die in der zirkulierenden Rohrleitung durch die Kühlplatte eingeschlossen ist, und die Wärme wird...
Details anzeigen -
Why do special gases used in semiconductor manufacturing processes require chillers?
849When using special gases in semiconductor manufacturing processes, a chiller is required, mainly due to the following reasons: 3. Process requirements: In semiconductor manufacturing processes such as chemical vapor deposition...
Details anzeigen -
How to choose a power battery test evaporator?
1289The corrosion of ferrous metals by salt water is very strong, and its corrosion is more severe when it comes into contact with air. Therefore, as far as the production process permits, closed loops should be used as much as possible. For volatile ...
Details anzeigen -